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  • 3D Solder Paste Inspection (SPI),Automated Optical Inspection (AOI),Measurement & Analysis Instruments
HomeProductsOptical Inspection3D Solder Paste Inspection (SPI),Automated Optical Inspection (AOI),Measurement & Analysis Instruments

3D Solder Paste Inspection (SPI),Automated Optical Inspection (AOI),Measurement & Analysis Instruments

TR7007 SII Plus

INTRODUCTION

With industry leading speeds of up to 200 cm2/sec, the TR7007 SII Plus is the perfect SPI solution for any production line. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision, reliable linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. TRI's quick and intuitive user interface makes programming simple and easy, bringing maximum value to your production.

  • Features
  • Industry leading inspection speed up to 200 cm2/sec @ 15 µm
    • Shadow free Fringe Pattern lighting technology
    • Optical resolution 10 µm or 15 µm
    • Linear motor design for stable and accurate inspection
    • Advanced SPC functions for production quality monitoring and evaluation
  • Optical System

    Imaging Method Dynamic Imaging
    Camera 4 Mpix
    Imaging Resolution 10 µm or 15 µm (factory setting)
    Lighting RGB LED
    3D Technology 2-way Digital Fringe Pattern
    Field of View 4 Mpix@ 10 µm: 20 x 20 mm
    4 Mpix@ 15 µm: 30 x 30 mm

    Inspection Performance

    Imaging Speed 4 Mpix@ 10 µm: 90 cm²/sec
    4 Mpix@ 15 µm: 200 cm²/sec
    Height Resolution 0.4 µm
    Max. Solder Height @ 10 µm: 420 µm
    @ 15 µm: 385 µm

    Motion Table & Control

    X-Axis Control Linear Motor and linear scale with DSP-based controller
    Y-Axis Control Ballscrew + AC-servo controller
    Z-Axis Control Ballscrew + AC-servo controller
    X-Y Axis Resolution 0.5 µm
    Z-Axis Resolution 1 µm

    Board Handling

    Max PCB Size TR7007 SII Plus: 510 x 460 mm
    TR7007L SII Plus: 660 x 610 mm
    TR7007 SII Plus DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
    PCB Thickness 0.6-5 mm
    Max PCB Weight 3 kg
    Top Clearance 25 mm
    Bottom Clearance 40 mm
    Edge Clearance 3 mm
    Conveyor Height 880 – 920 mm

    * SMEMA Compatible

    Inspection Functions

    Defects Insufficient Paste
    Excessive Paste
    Shape Deformity
    Missing Paste & Bridging
    Measurement Height
    Area
    Volume
    Offset

    Dimensions

    WxDxH TR7007 SII Plus: 1100 x 1570 x 1550
    TR7007L SII Plus: 1300 x 1610 x 1560 mm
    TR7007 SII Plus DL: 1100 x 1770 x 1560 mm

    Note: not including signal tower, signal tower height 520 mm
    Weight TR7007 SII Plus: 950 kg
    TR7007L SII Plus: 1250 kg
    TR7007 SII Plus DL: 1100 kg
 

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